The Wafer Sort Controller (WSC) provides the Product Map Editor to assist the user in creating the product specific control maps that define the wafer layout in terms of; tested die, edge die and areas of blank silicon.

Special positions such as the reference die, first die and sample die are easily defined and controlled.

All of the product specific parameters are incorporated in the control map as follows: –

• Wafer Diameter
• Die Size
• Flat Direction
• Reticle Size
• Probe Card Configuration
• Bin Definitions
• Yield Trigger
• Dynamic Bin Triggers
• Multi-Site Differential Triggers